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For the Inventor, By the Inventor

Hsin-Chu, Taiwan

Fang Wen Tsai

USPTO Granted Patents = 21

Average Co-Inventor Count = 5.3

ph-index = 7

Forward Citations = 225(Granted Patents)


Company Filing History:

goldMedal21 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2008-2021

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21 patents (USPTO):Explore Patents
1. 10910267 - Alignment marks in substrate having through-substrate via (TSV) (2021-02-02),
2. 10692764 - Alignment marks in substrate having through-substrate via (TSV) (2020-06-23),
3. 10163706 - Alignment marks in substrate having through-substrate via (TSV) (2018-12-25),
4. 9997497 - Through silicon via structure (2018-06-12),
5. 9633900 - Method for through silicon via structure (2017-04-25),
6. 9478480 - Alignment mark and method of formation (2016-10-25),
7. 9299676 - Through silicon via structure (2016-03-29),
8. 9099515 - Reconfigurable guide pin design for centering wafers having different sizes (2015-08-04),
9. 9093314 - Copper bump structures having sidewall protection layers (2015-07-28),
10. 8980706 - Double treatment on hard mask for gate N/P patterning (2015-03-17),
11. 8952506 - Through silicon via structure (2015-02-10),
12. 8928159 - Alignment marks in substrate having through-substrate via (TSV) (2015-01-06),
13. 8922004 - Copper bump structures having sidewall protection layers (2014-12-30),
14. 8900994 - Method for producing a protective structure (2014-12-02),
15. 8896136 - Alignment mark and method of formation (2014-11-25),

Title: The Innovations of Fang Wen Tsai in Semiconductor Technology

Introduction: Fang Wen Tsai is a renowned inventor based in Hsin-Chu, Taiwan, who has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 21 patents, he is recognized for his innovative approaches to device design and alignment methods that enhance manufacturing efficiency.

Latest Patents: Among his notable inventions are the patents for "Alignment marks in substrate having through-substrate via (TSV)." This device features a substrate equipped with an alignment mark, which includes a conductive through-substrate via (TSV) penetrating through the substrate. This technology is crucial for improving the precision of semiconductor fabrication processes.

Career Highlights: Fang Wen Tsai has a distinguished career at Taiwan Semiconductor Manufacturing Company Limited, where he continues to push the boundaries of technology. His work within this leading semiconductor firm has solidified his reputation as a key contributor to advancements in the industry.

Collaborations: Throughout his career, Fang has collaborated with other prominent engineers and inventors, including his coworkers Wen-Chih Chiou and Shin-Puu Jeng. These collaborations have enabled the fusion of ideas and techniques that have further enriched his innovative projects.

Conclusion: Fang Wen Tsai's work exemplifies the spirit of innovation in the semiconductor industry. With his extensive patent portfolio and collaboration with notable figures in the field, he continues to lead the way in developing technologies that shape the future of electronics. His contributions are invaluable, and his latest patents exemplify the strides being made in semiconductor technology.

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