The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2015
Filed:
Aug. 22, 2013
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Inventors:
Hsin Chang, Hsin-Chu, TW;
Hsin-Yu Chen, Taipei, TW;
Fang Wen Tsai, Hsin-Chu, TW;
Jing-Cheng Lin, Hsin-Chu, TW;
Wen-Chih Chiou, Miaoli, TW;
Shin-Puu Jeng, Hsin-Chu, TW;
Chen-Hua Yu, Hsin-Chu, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B66F 19/00 (2006.01); H01L 21/687 (2006.01); B65G 47/90 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6875 (2013.01); B65G 47/90 (2013.01); H01L 21/68707 (2013.01); Y10T 74/20305 (2015.01);
Abstract
An apparatus includes a robot arm, and a plurality of guide pins mounted on the robot arm. Each of the plurality of guide pins includes a plurality of wafer supports at different levels, with each of the plurality of wafer supports configured to support and center a wafer having a size different from wafers configured to be supported and centered by remaining ones of the plurality of wafer supports.