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For the Inventor, By the Inventor

Hsin-Chu, Taiwan

Hsin Chang

USPTO Granted Patents = 15 

Average Co-Inventor Count = 2.2

ph-index = 3

Forward Citations = 151(Granted Patents)


Location History:

  • Taichung City, TW (2006 - 2007)
  • Hsinchu City, TW (2015)
  • Hsinchu, TW (2010 - 2021)

Company Filing History:

goldMedal11 out of 40,927 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal4 out of 832,912 
Other
 patents

Years Active: 2006-2021

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15 patents (USPTO):Explore Patents
1. 10910267 - Alignment marks in substrate having through-substrate via (TSV) (2021-02-02),
2. 10692764 - Alignment marks in substrate having through-substrate via (TSV) (2020-06-23),
3. 10163706 - Alignment marks in substrate having through-substrate via (TSV) (2018-12-25),
4. 9123643 - Chip-on-wafer structures and methods for forming the same (2015-09-01),
5. 9099515 - Reconfigurable guide pin design for centering wafers having different sizes (2015-08-04),
6. 8962481 - Chip-on-wafer structures and methods for forming the same (2015-02-24),
7. 8928159 - Alignment marks in substrate having through-substrate via (TSV) (2015-01-06),
8. 8643148 - Chip-on-Wafer structures and methods for forming the same (2014-02-04),
9. 8567837 - Reconfigurable guide pin design for centering wafers having different sizes (2013-10-29),
10. 7800731 - Method and apparatus for removing particles in immersion lithography (2010-09-21),
11. 7728952 - Method and system for closing plate take-over in immersion lithography (2010-06-01),
12. 7194939 - Pneumatic wrench having reinforced strength (2007-03-27),
13. 7182149 - Pneumatic wrench having reinforced strength (2007-02-27),
14. 7165631 - Pneumatic wrench having enhanced strength (2007-01-23),
15. 7140282 - Pneumatic wrench having reinforced strength (2006-11-28),

Title: Hsin Chang: Innovator in Semiconductor Technology

Introduction

Hsin Chang is a prominent inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 15 patents. His work has been instrumental in advancing the capabilities of electronic devices.

Latest Patents

Among his latest innovations is a patent for alignment marks in substrates featuring through-substrate vias (TSV). This device includes a substrate and an alignment mark that incorporates a conductive TSV penetrating through the substrate. This technology enhances the precision and efficiency of semiconductor manufacturing processes.

Career Highlights

Hsin Chang has had a notable career, working with Taiwan Semiconductor Manufacturing Company Limited, a leader in the semiconductor industry. His expertise and innovative spirit have contributed to the development of cutting-edge technologies in this field.

Collaborations

Throughout his career, Hsin Chang has collaborated with talented individuals such as Jing-Cheng Lin and Fang Wen Tsai. These partnerships have fostered a creative environment that has led to groundbreaking advancements in semiconductor technology.

Conclusion

Hsin Chang's contributions to the semiconductor industry through his patents and collaborations highlight his role as a key innovator. His work continues to influence the future of technology and electronic devices.

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