Taiwan Semiconductor Manufacturing Comp. Ltd.

Other

Hsin Chang

Jing-Cheng Lin

Shin-Puu Jeng

Wen-Chih Chiou

Fang Wen Tsai

Shih Ting Lin

Chen-Hua Douglas Yu

Hsin-Yu Chen

Tzung-Chi Fu

Tsai-Sheng Gau

Jin-Cheng Lin

A device includes a substrate, and an alignment mark including a conductive through-substrate via (TSV) penetrating through the substrate.

Alignment marks in substrate having through-substrate via (TSV)

A package component includes a substrate, wherein the substrate has a front surface and a back surface over the front surface. A through-via penetrates through the substrate. A conductive feature is disposed over the back surface of the substrate and electrically coupled to the through-via. A first dielectric pattern forms a ring covering edge portions of the conductive feature. An Under-Bump-Metallurgy (UBM) is disposed over and in contact with a center portion of the conductive feature. A polymer contacts a sidewall of the substrate. A second dielectric pattern is disposed over and aligned to the polymer. The first and the second dielectric patterns are formed of a same dielectric material, and are disposed at substantially a same level.

Chip-on-wafer structures and methods for forming the same

An apparatus includes a robot arm, and a plurality of guide pins mounted on the robot arm. Each of the plurality of guide pins includes a plurality of wafer supports at different levels, with each of the plurality of wafer supports configured to support and center a wafer having a size different from wafers configured to be supported and centered by remaining ones of the plurality of wafer supports.

Reconfigurable guide pin design for centering wafers having different sizes

Chip-on-Wafer structures and methods for forming the same

A method and system involve supplying an immersion fluid to a space between an imaging lens and a substrate to be patterned, generating an electric field in the immersion fluid within the space so that the electric field urges particles away from a surface of the substrate, removing the immersion fluid along with the particles from the space, and thereafter supplying immersion fluid to the space and performing a lithographic exposing process on the surface of the substrate.

Method and apparatus for removing particles in immersion lithography

Aspects of the present disclosure provide a method and a system for closing plate take-over in immersion lithography. A plate holder is provided for a closing plate in a wafer holder of an immersion lithography system. An optical detector is provided below the plate holder for determining whether a light signal passing through the closing plate is aligned with the plate holder using the optical detector. If the light signal is aligned, a fluid containment mechanism is lowered, and the closing plate is placed into the plate holder. Alternatively, the fluid containment mechanism is lowered to surface of the closing plate, the closing plate is affixed to the mechanism, and the mechanism is raised with the closing plate. If the light signal is not aligned, an error is triggered and the scanner is stopped.

Method and system for closing plate take-over in immersion lithography

A pneumatic wrench includes a pneumatic motor, a striking mechanism, and a drive shaft. The striking mechanism includes a support seat, a cam, a cover, and a hammer. Thus, the pivot shaft of the hammer has two opposite sides each formed with a reinforcing rib to reinforce the structural strength of the hammer. In addition, each of the first pivot shaft and the second pivot shaft has a guide groove to overcome the shear stress applied on the hammer during the rotation striking process of the hammer, thereby preventing the hammer from being distorted or broken due to concentration of a stress so as to enhance the lifetime of the hammer.

Pneumatic wrench having reinforced strength

A pneumatic wrench includes a pneumatic motor, a striking portion, and a drive shaft. The striking portion includes a support seat, a first pin, a second pin, a first hammer, and a second hammer. Thus, the locking strip of the first hammer and the locking strip of the second hammer increase the thickness of the first hammer and the second hammer respectively to reinforce the structural strength of the first hammer and the second hammer, thereby preventing the first hammer and the second hammer from being broken due to vibration so as to increase the lifetime of the first hammer and the second hammer.

A pneumatic wrench includes a pneumatic motor, a striking portion, and a drive shaft. The striking portion includes a support seat, a first hammer, and a second hammer. Thus, the first hammer and the second hammer are driven by the fixed pins and the movable pins of the support seat respectively, thereby preventing the fixed pins and the movable pins from being worn out or broken due to a stress concentration so as to increase the lifetime of the pneumatic wrench. In addition, the connecting rib is located between and connected to the first driven block and the second driven block of the drive shaft so as to enhance the structural strength of the drive shaft.

Pneumatic wrench having enhanced strength

A pneumatic wrench includes a pneumatic motor, a striking mechanism, and a drive shaft. The striking mechanism includes a cylindrical support seat, a cam, a cover, and a hammer. The hammer has a protruding engaging portion and a reinforcing rib juxtaposed to the engaging portion to reinforce the structural strength of the hammer. Thus, the two opposite sides of the hammer are connected by the reinforcing rib to reinforce the structural strength of the hammer, thereby preventing the hammer from being distorted or broken due to concentration of a stress so as to enhance the lifetime of the hammer.

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Hsin-Chu, Taiwan

Hsin Chang