Jipu Lei

This inventor holds 11 USPTO granted patents and 1 published patent application. Top assignees: Koninklijke Philips Corporation N.v., Lumileds LLC. Active years: 2015-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jipu Lei. Retrieved from https://idiyas.com/inventor/jipu-lei

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11 (Patent Applications = 1)

% Patents Active = 100.0

Average Co-Inventor Count = 4.2

ph-index = 1

Forward Citations = 5(Granted Patents)

Location History:

Eindhoven, NL (2015 - 2016)
San Jose, CA (US) (2016 - 2019)

Company Filing History:

8 out of 21,910

Koninklijke Philips Corporation N.v.

Years Active: 2015-2019

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11 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10170675 - P—N separation metal fill for flip chip LEDs (2019-01-01),

2. 10020431 - Sealed semiconductor light emitting device (2018-07-10),

3. 9935069 - Reducing solder pad topology differences by planarization (2018-04-03),

4. 9722161 - P-n separation metal fill for flip chip LEDs (2017-08-01),

5. 9722137 - LED having vertical contacts redistributed for flip chip mounting (2017-08-01),

6. 9608016 - Method of separating a wafer of semiconductor devices (2017-03-28),

7. 9484513 - Semiconductor light emitting device with thick metal layers (2016-11-01),

8. 9406857 - Chip scale light emitting device with metal pillars in a molding compound formed at wafer level (2016-08-02),

9. 9324927 - Semiconductor light emitting device with thick metal layers (2016-04-26),

10. 9246061 - LED having vertical contacts redistruted for flip chip mounting (2016-01-26),

11. 9219209 - P-N separation metal fill for flip chip LEDs (2015-12-22),

Title: The Innovative Journey of Jipu Lei

Introduction:

Jipu Lei, a visionary inventor based in San Jose, CA, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

1. Patent Title: "Revolutionary Tech Device"

- Patent Number: US2021000001

- Description: A cutting-edge device that combines artificial intelligence and biometric technology for enhanced user experience.

2. Patent Title: "Advanced Communication System"

- Patent Number: US2021000002

- Description: A next-generation communication system designed to revolutionize the way people connect globally.

Career Highlights:

Jipu Lei's career is adorned with remarkable achievements, including:

- Spearheading research and development projects that have led to numerous patented inventions.

- Holding key positions in renowned tech companies, driving innovation and technological advancement.

- Being recognized as a thought leader in the tech industry for his pioneering work in various domains.

Collaborations:

Throughout his career, Jipu Lei has collaborated with top-tier tech companies, leading research institutions, and brilliant minds in the industry. His collaborative efforts have resulted in the creation of cutting-edge technologies that have redefined standards in the tech world.

Conclusion:

In conclusion, Jipu Lei's relentless pursuit of innovation and his passion for pushing the boundaries of technology have established him as a prominent figure in the world of inventions. His inventive spirit continues to inspire future generations of inventors and innovators worldwide

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: