The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 2018
Filed:
Jun. 05, 2014
Lumileds Llc, San Jose, CA (US);
Jipu Lei, San Jose, CA (US);
Stefano Schiaffino, San Jose, CA (US);
Alexander H. Nickel, San Jose, CA (US);
Mooi Guan Ng, San Jose, CA (US);
Salman Akram, San Jose, CA (US);
LUMILEDS LLC, San Jose, CA (US);
Abstract
A technique is disclosed for causing the top surfaces of solder bumps on a chip to be in the same plane to ensure a more reliable bond between the chip and a substrate. The chip is provided with solder pads that may have different heights. A dielectric layer is formed between the solder pads. A relatively thick metal layer is plated over the solder pads. The metal layer is planarized to cause the top surfaces of the metal layer portions over the solder pads to be in the same plane and above the dielectric layer. A substantially uniformly thin layer of solder is deposited over the planarized metal layer portions so that the top surfaces of the solder bumps are substantially in the same plane. The chip is then positioned over a substrate having corresponding metal pads, and the solder is reflowed or ultrasonically bonded to the substrate pads.