The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2016

Filed:

Feb. 28, 2012
Applicants:

Jipu Lei, Eindhoven, NL;

Kwong-hin Henry Choy, Eindhoven, NL;

Yajun Wei, Eindhoven, NL;

Stefano Schiaffino, Eindhoven, NL;

Danel Alexander Steigerwald, Eindhoven, NL;

Inventors:

Jipu Lei, Eindhoven, NL;

Kwong-Hin Henry Choy, Eindhoven, NL;

Yajun Wei, Eindhoven, NL;

Stefano Schiaffino, Eindhoven, NL;

Danel Alexander Steigerwald, Eindhoven, NL;

Assignee:

Koninklijke Philips N.V., Eindhoven, NL;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/38 (2010.01); H01L 25/16 (2006.01); H01L 33/00 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/38 (2013.01); H01L 24/06 (2013.01); H01L 25/167 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 33/0079 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/06102 (2013.01); H01L 2224/13144 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A light emitting diode (LED) structure has semiconductor layers, including a p-type layer, an active layer, and an n-Type layer. The p-type layer has a bottom surface, and the n-type layer has a top surface though which light is emitted. A copper layer has a first portion electrically connected to and opposing the bottom surface of the p-type layer. A dielectric wall extends through the copper layer to isolate a second portion of the copper layer from the first portion. A metal shunt electrically connects the second portion of the copper layer to the top surface of the n-type layer. P-metal electrodes electrically connect to the first portion, and n-metal electrodes electrically connect to the second portion, wherein the LED structure forms a flip chip. Other embodiments of the methods and structures are also described.


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