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For the Inventor, By the Inventor

Neubiberg, Germany

Jesus Mennen Belonio, Jr

This inventor holds 13 USPTO granted patents and 3 published patent applications, primarily in Wafer Level Packaging. Top assignees: Dialog Semiconductor (UK) Limited, Dialog Semiconductor B.v., Dialog Semiconductor Gmbh. Active years: 2018-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jesus Mennen Belonio, Jr. Retrieved from https://idiyas.com/inventor/jesus-mennen-belonio-jr

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 13 

% Patents Active = 100.0

Average Co-Inventor Count = 3.9

ph-index = 3

Forward Citations = 17(Granted Patents)


Company Filing History:

goldMedal11 out of 425 
 
Dialog Semiconductor (UK) Limited
 patents
silverMedal1 out of 99 
 
Dialog Semiconductor B.v.
 patents
bronzeMedal1 out of 511 
 
Dialog Semiconductor Gmbh
 patents

Years Active: 2018-2024

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Areas of Expertise:
Embedded Resistor-Capacitor Film
Fan Out Wafer Level Packaging
Pillared Cavity Down MIS-SiP
Thin Embedded Trace Substrate
Integrated Circuit Package
Wafer Level Chip Scale Package
Modular WLCSP Design
Through Mold Via
Stress Relief Solutions
Low Cost Package
System In Package
Chip Scale Package Structure
13 patents (USPTO):Explore Patents
1. 12100674 - Embedded resistor-capacitor film for fan out wafer level packaging (2024-09-24),
2. 11532489 - Pillared cavity down MIS-SiP (2022-12-20),
3. 11309255 - Very thin embedded trace substrate-system in package (SIP) (2022-04-19),
4. 11251132 - Integrated type MIS substrate for thin double side SIP package (2022-02-15),
5. 11239185 - Embedded resistor-capacitor film for fan out wafer level packaging (2022-02-01),
6. 11158551 - Modular WLCSP die daisy chain design for multiple die sizes (2021-10-26),
7. 11114359 - Wafer level chip scale package structure (2021-09-07),
8. 11094669 - Wafer level molded PPGA (pad post grid array) for low cost package (2021-08-17),
9. 11075167 - Pillared cavity down MIS-SIP (2021-07-27),
10. 10727174 - Integrated circuit package and a method for forming a wafer level chip scale package (WLCSP) with through mold via (TMV) (2020-07-28),
11. 10636742 - Very thin embedded trace substrate-system in package (SIP) (2020-04-28),
12. 10629507 - System in package (SIP) (2020-04-21),
13. 10083926 - Stress relief solutions on WLCSP large/bulk copper plane design (2018-09-25),

Title: **Inventor Jesus Mennen Belonio, Jr.: A Pioneer in Advanced Packaging Technologies**

Introduction

Jesus Mennen Belonio, Jr. is a notable inventor based in Neubiberg, Germany. With an impressive portfolio of 13 patents, he has made significant contributions to the field of advanced packaging technologies, particularly in the area of semiconductor innovations. His inventive spirit continues to inspire others in the industry.

Latest Patents

Among his latest patents is the invention of an "Embedded Resistor-Capacitor Film for Fan-Out Wafer Level Packaging." This innovative panel-type packaging integrates embedded film-type capacitors and resistors. It features a silicon die encapsulated in a molding compound, interconnected redistributions layers, and embedded capacitor and resistor materials laminated onto the package. This advancement facilitates more efficient electronic packaging with improved performance.

Another significant patent is the "Pillared Cavity Down MIS-SiP." This technology provides a substrate with both top and bottom copper pillars connected to redistribution layers. It includes a cavity that houses a silicon die, enhancing electrical connectivity between components. The use of solder balls on copper pillars on the substrate's bottom side ensures reliable package output.

Career Highlights

Throughout his career, Jesus has worked with esteemed companies such as Dialog Semiconductor (UK) Limited and Dialog Semiconductor GmbH. His roles at these organizations have allowed him to drive innovation in semiconductor packaging and work on cutting-edge technologies that shape the industry's future.

Collaborations

In addition to his independent work, Jesus has collaborated with skilled professionals such as Ernesto Gutierrez, III, and Shou Cheng Eric Hu. These collaborations have fostered an environment of innovation and creativity, contributing to the successful development of his patented technologies.

Conclusion

Jesus Mennen Belonio, Jr. stands as an influential figure in the world of semiconductor innovations. His dedication to advancing packaging technologies through his patents illustrates his commitment to innovation. As he continues to push the boundaries of what is possible, his contributions will likely have a lasting impact on the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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