The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2021
Filed:
Jan. 07, 2020
Dialog Semiconductor (Uk) Limited, London, GB;
Duncan Barclay, Swindon, GB;
Jesus Mennen Belonio, Jr., Neubiberg, DE;
Edward Horsburgh, Devizes, GB;
Dialog Semiconductor (UK) Limited, London, GB;
Abstract
A method to fabricate a modular die daisy chain design for wafer level chip scale package (WLCSP) board level reliability testing is described. A wafer is provided having pairs of solder balls electrically connected to each other by underlying metal pads. The wafer is singulated into dies of any of a plurality of sizes as required for testing. Thereafter one of the singulated dies is mounted to a test printed circuit board (PCB). The pairs of solder balls are electrically connected in a daisy chain on the test PCB.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile