Edward Horsburgh

Title: Edward Horsburgh: Innovator in Modular WLCSP Die Design

Introduction

Edward Horsburgh is a notable inventor based in Devizes, GB. He has made significant contributions to the field of semiconductor technology, particularly in the design of wafer level chip scale packages (WLCSP). His innovative approach has led to advancements in board level reliability testing.

Latest Patents

Horsburgh holds a patent for a "Modular WLCSP die daisy chain design for multiple die sizes." This patent describes a method to fabricate a modular die daisy chain design for WLCSP board level reliability testing. The process involves providing a wafer with pairs of solder balls that are electrically connected by underlying metal pads. The wafer is then singulated into dies of various sizes as required for testing. One of the singulated dies is subsequently mounted to a test printed circuit board (PCB), where the pairs of solder balls are electrically connected in a daisy chain configuration.

Career Highlights

Edward Horsburgh is currently employed at Dialog Semiconductor (UK) Limited, where he continues to innovate in the semiconductor industry. His work focuses on enhancing the reliability and efficiency of semiconductor packaging technologies.

Collaborations

Horsburgh has collaborated with notable colleagues such as Duncan Barclay and Jesus Mennen Belonio, Jr. These partnerships have contributed to the development of cutting-edge technologies in the field.

Conclusion

Edward Horsburgh's contributions to the semiconductor industry, particularly through his patent on modular WLCSP die design, highlight his role as an innovator. His work continues to influence advancements in board level reliability testing and semiconductor technology.