The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2020
Filed:
Sep. 28, 2017
Dialog Semiconductor (Uk) Limited, London, GB;
Jesus Mennen Belonio, Jr., Neubiberg, DE;
Shou Cheng Eric Hu, Taichung, TW;
Ian Kent, Chippenham, GB;
Ernesto Gutierrez, III, Swindon, GB;
Melvin Martin, Fellbach, DE;
Rajesh Subraya Aiyandra, Denkendorf, DE;
Dialog Semiconductor (US) Limited, London, GB;
Abstract
A system in package is provided comprising an embedded trace substrate having redistribution layers therein, at least one passive component mounted on one side of the embedded trace substrate and embedded in a first molding compound, at least one silicon die mounted on an opposite side of the embedded trace substrate and embedded in a second molding compound wherein electrical connections are made between the at least one silicon die and the at least one passive component through the redistribution layers, and solder balls mounted through openings in the second molding layer to the redistribution layers wherein the solder balls provide package output.