Shou Cheng Eric Hu

Title: Shou Cheng Eric Hu: Innovator in Embedded Technologies

Introduction

Shou Cheng Eric Hu is a prominent inventor based in Taichung, Taiwan. He holds a total of 8 patents that showcase his expertise in embedded technologies and semiconductor packaging. His innovative contributions have significantly advanced the field of electronics.

Latest Patents

One of his latest patents is titled "Embedded resistor-capacitor film for fan out wafer level packaging." This invention describes a panel type fan-out wafer level package that incorporates embedded film type capacitors and resistors. The package features a silicon die at the bottom, encapsulated in a molding compound, with at least one redistribution layer connected to the silicon die through copper posts. Additionally, it includes embedded capacitor material sheets and embedded resistor-conductor material sheets that are electrically interconnected.

Another notable patent is the "Very thin embedded trace substrate-system in package (SIP)." This system in package comprises an embedded trace substrate with redistribution layers, passive components mounted on one side, and a silicon die on the opposite side. Electrical connections are established between the silicon die and passive components through the redistribution layers, with solder balls providing package output.

Career Highlights

Shou Cheng Eric Hu has worked with reputable companies such as Dialog Semiconductor (UK) Limited and Dialog Semiconductor GmbH. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technology in the semiconductor industry.

Collaborations

Throughout his career, he has collaborated with notable individuals, including Jesus Mennen Belonio, Jr. and Ernesto Gutierrez, III. These collaborations have further enriched his work and innovation in the field.

Conclusion

Shou Cheng Eric Hu is a distinguished inventor whose work in embedded technologies has made a significant impact on the electronics industry. His patents reflect his commitment to innovation and excellence in semiconductor packaging.