Chippenham, United Kingdom

Ian Kent

USPTO Granted Patents = 6 


Average Co-Inventor Count = 2.2

ph-index = 3

Forward Citations = 24(Granted Patents)


Location History:

  • Calne, GB (2018)
  • Chippenham, GB (2018 - 2022)

Company Filing History:


Years Active: 2018-2022

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6 patents (USPTO):Explore Patents

Title: Ian Kent: Innovator in Embedded Systems

Introduction

Ian Kent is a prominent inventor based in Chippenham, GB, known for his contributions to the field of embedded systems. With a total of 6 patents to his name, he has made significant advancements in technology that enhance the functionality and efficiency of electronic devices.

Latest Patents

Among his latest innovations is the "Very thin embedded trace substrate-system in package (SIP)." This invention features an embedded trace substrate with redistribution layers, passive components, and silicon dies, all integrated within molding compounds. The design allows for efficient electrical connections and package outputs through solder balls. Another notable patent is the "Wafer level chip scale package structure," which involves a sophisticated process of forming copper posts on silicon dies, enhancing the reliability and performance of semiconductor devices.

Career Highlights

Ian Kent has worked with notable companies such as Dialog Semiconductor (UK) Limited and Dialog Semiconductor GmbH. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technologies in the semiconductor industry.

Collaborations

Ian has collaborated with talented individuals in his field, including Jesus Mennen Belonio, Jr. and Ernesto Gutierrez, III. These partnerships have fostered innovation and the development of advanced technologies.

Conclusion

Ian Kent's work in embedded systems and semiconductor technology showcases his dedication to innovation. His patents reflect a commitment to improving electronic device performance and efficiency.

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