The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2018
Filed:
Oct. 21, 2016
Applicant:
Dialog Semiconductor Gmbh, Kirchheim/Tech-Nabern, DE;
Inventor:
Ian Kent, Calne, GB;
Assignee:
Dialog Semiconductor GmbH, Kirchheim/Teck-Nabern, DE;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 25/16 (2006.01); H01L 23/29 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 23/13 (2013.01); H01L 23/293 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49866 (2013.01); H01L 23/49894 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 25/0657 (2013.01); H01L 25/16 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16265 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06568 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15156 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/181 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19051 (2013.01); H01L 2924/19104 (2013.01);
Abstract
An integrated passive device and power management integrated circuit are directly connected, active surface to active surface, resulting in a pyramid die stack. The die stack is flip-chip attached to a laminate substrate having a cavity drilled therein wherein the smaller die fits into the cavity. The die to die attach is not limited to IPD and PMIC and can be used for other die types as required.