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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10418342 B1

PDFFull Text
Date of Patent:
Sep. 17, 2019

Filed:

Apr. 26, 2018

Silicon strip fan out system in package

Applicant:

Dialog Semiconductor (Uk) Limited, London, GB;

Inventor:

Ian Kent, Chippenham, GB;

Assignee:

Dialog Semiconductor (UK) Limited, London, GB;

Attorneys:

Saile Ackerman LLC

Stephen B. Ackerman

Rosemary L. S. Pike

Primary Examiner:

Thien F Tran

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 24/96 (2013.01); H01L 21/4857 (2013.01); H01L 21/4864 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 2224/214 (2013.01); H01L 2924/19106 (2013.01); H01L 2924/3511 (2013.01);
Abstract

A method to fabricate a reconstructed panel based fan-out wafer level package is described. A reconstructed wafer panel is provided comprising a plurality of individual dies encapsulated in a first molding compound. Interconnected metal redistribution layers (RDL) separated by PSV layers are formed on top surfaces of the plurality of individual dies. Thereafter, the reconstructed wafer panel is cut into a plurality of rectangular strips. Thereafter, backend processing is performed on each of the plurality of rectangular strips.

Find Patent Forward Citations

Kent, Ian. (2019). Silicon strip fan out system in package (U.S. Patent No. 10418342). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10418342

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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