Rajesh Subraya Aiyandra

Title: Rajesh Subraya Aiyandra: Innovator in Semiconductor Packaging

Introduction

Rajesh Subraya Aiyandra is a prominent inventor based in Denkendorf, Germany. He has made significant contributions to the field of semiconductor packaging, holding a total of 10 patents. His innovative work focuses on enhancing the efficiency and performance of high power semiconductor devices.

Latest Patents

One of his latest patents is a multi-pin wafer-level chip scale packaging solution for high power semiconductor devices. This invention achieves a multi-pin wafer level chip scale package by forming one or more solder pillars and solder blocks on a silicon wafer. The design ensures that the top surfaces of the solder pillars and blocks are in the same horizontal plane. A pillar metal layer underlies the solder pillars, establishing electrical contact with the silicon wafer through an opening in a polymer layer over a passivation layer. Additionally, a block metal layer underlies the solder blocks, providing electrical contact through multiple via openings in the polymer layer, with the block metal layer being thicker than the pillar metal layer.

Career Highlights

Rajesh has worked with notable companies such as Dialog Semiconductor (UK) Limited and Dialog Semiconductor GmbH. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Throughout his career, Rajesh has collaborated with talented individuals, including Habeeb Mohiuddin Mohammed and Jesus Mennen Belonio, Jr. These collaborations have fostered a creative environment that has led to innovative solutions in the semiconductor industry.

Conclusion

Rajesh Subraya Aiyandra is a distinguished inventor whose work in semiconductor packaging has made a significant impact on the industry. His patents reflect his commitment to innovation and excellence in technology.