The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Mar. 25, 2019
Applicant:
Dialog Semiconductor (Uk) Limited, London, GB;
Inventors:
Assignee:
Dialog Semiconductor (UK) Limited, London, GB;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 7/20 (2006.01); H05K 1/11 (2006.01); H01L 23/373 (2006.01); H01L 23/473 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01); H01L 23/373 (2013.01); H01L 23/473 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H05K 7/2029 (2013.01); H05K 2201/10734 (2013.01);
Abstract
An integrated circuit package having excellent heat dissipation is described. An integrated circuit die is attached to a substrate and the substrate is mounted on a printed circuit board (PCB) wherein there is a gap between a surface of the die facing the PCB and the PCB. A thermal enhanced layer is formed within the gap wherein heat travels from the die through the thermal enhanced layer to the PCB.