Baltazar Canete

Title: Baltazar Canete: Innovator in Integrated Circuit Packaging

Introduction

Baltazar Canete is a notable inventor based in Waiblingen, Germany. He has made significant contributions to the field of integrated circuit packaging, holding 2 patents that enhance the performance and efficiency of electronic devices. His work focuses on improving heat dissipation and the assembly of multiple electronic components within a single package.

Latest Patents

One of Baltazar's latest patents is titled "Thermal enhancement of exposed die-down package." This patent describes an integrated circuit package designed for excellent heat dissipation. In this innovation, an integrated circuit die is attached to a substrate, which is then mounted on a printed circuit board (PCB). A gap is maintained between the die and the PCB, allowing a thermal enhanced layer to facilitate heat transfer from the die to the PCB.

Another significant patent is "Integrated circuit package for assembling various dice in a single IC package." This invention presents an IC package that includes one or more pins for electrical connection to a PCB. The package contains a first die with a semiconductor power device and a second die with a control circuit. A conductive plate connects these components, establishing electrical connections and enhancing the overall functionality of the package.

Career Highlights

Baltazar Canete has worked with prominent companies in the semiconductor industry, including Dialog Semiconductor (UK) Limited and Dialog Semiconductor GmbH. His experience in these organizations has contributed to his expertise in integrated circuit technology and innovation.

Collaborations

Throughout his career, Baltazar has collaborated with talented individuals such as Rajesh Subraya Aiyandra and Tung Ching Lui. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies in the field.

Conclusion

Baltazar Canete is a distinguished inventor whose work in integrated circuit packaging has made a significant impact on the electronics industry. His innovative patents and collaborations highlight his commitment to advancing technology and improving electronic device performance.