Stuttgart, Germany

Melvin Martin

This inventor holds 5 USPTO granted patents and 3 published patent applications and 1 EPO patent. Top assignees: Dialog Semiconductor (UK) Limited, Dialog Semiconductor Gmbh. Active years: 2019-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Melvin Martin. Retrieved from https://idiyas.com/inventor/melvin-martin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 5 

% Patents Active = 100.0

 

Average Co-Inventor Count = 5.5

ph-index = 1

Forward Citations = 6(Granted Patents)


Location History:

  • Stuttgart, DE (2019 - 2022)
  • Fellbach, DE (2020 - 2022)

Company Filing History:


Years Active: 2019-2022

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5 patents (USPTO):Explore Patents

Title: Melvin Martin: Innovator in Substrate Technology

Introduction

Melvin Martin is a distinguished inventor based in Stuttgart, Germany. He holds a total of 5 patents that showcase his expertise in substrate technology and electronic packaging. His innovative contributions have significantly impacted the field of microelectronics.

Latest Patents

Among his latest patents is the "Pillared cavity down MIS-SiP." This invention involves a substrate with redistribution layers, copper pillars, and cavities designed to enhance the integration of passive components and silicon dies. Another notable patent is the "Very thin embedded trace substrate-system in package (SIP)," which features an embedded trace substrate that allows for efficient electrical connections between components, optimizing the overall performance of the package.

Career Highlights

Melvin has worked with prominent companies such as Dialog Semiconductor (UK) Limited and Dialog Semiconductor GmbH. His experience in these organizations has allowed him to refine his skills and contribute to cutting-edge technologies in the semiconductor industry.

Collaborations

Throughout his career, Melvin has collaborated with talented individuals, including Jesus Mennen Belonio, Jr. and Ernesto Gutierrez, III. These partnerships have fostered innovation and creativity in his projects.

Conclusion

Melvin Martin's contributions to substrate technology and electronic packaging are noteworthy. His patents reflect a commitment to advancing the field and improving the functionality of electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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