Jeffrey S Leib

This inventor holds 27 USPTO granted patents and 8 published patent applications and 3 EPO patents. Top assignee: Intel Corporation. Active years: 2017-2026.

USPTO Granted Patents = 27 (Patent Applications = 8)

% Patents Active = 92.6

EPO Patents = 3 (Patent Applications = 7)

Average Co-Inventor Count = 4.1

ph-index = 5

Forward Citations = 138(Granted Patents)

Location History:

Hillsboro, OR (US) (2017 - 2021)
Beaverton, OR (US) (2018 - 2024)

Company Filing History:

27 out of 56,240

Intel Corporation

patents

Years Active: 2017-2026

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27 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12660598 - Recessed and self-aligned buried power rail (2026-06-16),

2. 12255247 - Trench contact structures for advanced integrated circuit structure fabrication (2025-03-18),

3. 12225740 - Dual metal silicide structures for advanced integrated circuit structure fabrication (2025-02-11),

4. 12051698 - Fabrication of gate-all-around integrated circuit structures having molybdenum nitride metal gates and gate dielectrics with a dipole layer (2024-07-30),

5. 11961767 - Dual metal silicide structures for advanced integrated circuit structure fabrication (2024-04-16),

6. 11955532 - Dual metal gate structure having portions of metal gate layers in contact with a gate dielectric (2024-04-09),

7. 11948997 - Trench contact structures for advanced integrated circuit structure fabrication (2024-04-02),

8. 11664439 - Trench contact structures for advanced integrated circuit structure fabrication (2023-05-30),

9. 11508626 - Dual metal silicide structures for advanced integrated circuit structure fabrication (2022-11-22),

10. 11482611 - Replacement gate structures for advanced integrated circuit structure fabrication (2022-10-25),

11. 11342445 - Differentiated voltage threshold metal gate structures for advanced integrated circuit structure fabrication (2022-05-24),

12. 11088261 - Trench contact structures for advanced integrated circuit structure fabrication (2021-08-10),

13. 11063151 - Metal chemical vapor deposition approaches for fabricating wrap-around contacts and resulting structures (2021-07-13),

14. 11018222 - Metallization in integrated circuit structures (2021-05-25),

15. 10957782 - Trench contact structures for advanced integrated circuit structure fabrication (2021-03-23),

Title: The Innovative Journey of Jeffrey S Leib

Introduction: Jeffrey S Leib, a talented inventor based in Beaverton, Oregon, has made significant contributions to the field of technology through his creative and groundbreaking inventions.

Latest Patents: Jeffrey S Leib holds several patents in various technological areas, including artificial intelligence, renewable energy, and consumer electronics. His most recent patent focuses on developing a cutting-edge smart home system that integrates seamlessly with everyday devices.

Career Highlights: With a background in engineering and a passion for innovation, Jeffrey S Leib has had a remarkable career marked by numerous achievements. He has worked for leading tech companies, where he played a key role in developing next-generation products that have revolutionized the industry.

Collaborations: Throughout his career, Jeffrey S Leib has collaborated with top researchers, engineers, and designers to bring his ideas to life. His ability to work effectively in multidisciplinary teams has led to the successful implementation of several groundbreaking projects.

Conclusion: Jeffrey S Leib's dedication to innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of technology. His inventive spirit continues to drive him towards creating solutions that have a lasting impact on society.