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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12787744 B1

PDFFull Text
Date of Patent:
Nov. 03, 2026

Filed:

Nov. 08, 2021

Integrated circuit interconnect structures including copper-free vias

Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Daniel B. Obrien, Beaverton, OR (US);

Jeffrey S. Leib, Beaverton, OR (US);

James Y. Jeong, Beaverton, OR (US);

Chia-Hong Jan, Portland, OR (US);

Peng Bai, Hillsboro, OR (US);

Seungdo An, Portland, OR (US);

Pavel S. Plekhanov, Portland, OR (US);

Debashish Basu, Beaverton, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:

Essential Patents Group, LLP

Primary Examiner:

Peter Bradford

Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01); H10W 20/00 (2026.01); H10W 20/41 (2026.01); H10W 20/42 (2026.01);
U.S. Cl.
CPC ...
H10W 20/42 (2026.01); H10W 20/033 (2026.01); H10W 20/056 (2026.01); H10W 20/425 (2026.01);
Abstract

Integrated circuit interconnect structure compatible with single damascene techniques and that includes a non-copper via comprising metal(s) of low resistivity that can be deposited at low temperature in a manner that also ensures good adhesion. Metal(s) suitable for the non-copper via may have BCC crystallinity that can advantageously template favorable crystallinity within a diffusion barrier of the upper-level interconnect feature, further reducing electrical resistance of an interconnect structure.

Find Patent Forward Citations

Quick Actions:

Obrien, Daniel. (2026). Integrated circuit interconnect structures including copper-free vias (U.S. Patent No. 12787744). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787744

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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