Peng Bai

Title: Innovations by Inventor Peng Bai

Introduction

Peng Bai is an accomplished inventor based in Aloha, Oregon, known for his significant contributions to the field of interconnection structures. With a total of 3 patents to his name, he has made notable advancements that enhance the reliability and performance of electronic components.

Latest Patents

Among his latest patents is the "Via hole profile and method of fabrication," which presents a novel high-performance interconnection structure designed to prevent via delamination. This innovative structure features a via connection that extends into and undercuts an underlying interconnection line, effectively locking the via connection into the interconnection line. Another significant patent is the "Anchored via connection," which shares similar attributes and aims to provide a reliable solution for preventing via delamination.

Career Highlights

Peng Bai is currently employed at Intel Corporation, where he continues to push the boundaries of technology through his inventive work. His expertise in interconnection structures has positioned him as a valuable asset within the company.

Collaborations

Throughout his career, Peng Bai has collaborated with notable colleagues, including Alan M Myers and Peter K Charvat, contributing to a dynamic and innovative work environment.

Conclusion

Peng Bai's contributions to the field of interconnection structures exemplify his dedication to innovation and technology. His patents not only enhance the performance of electronic components but also reflect his commitment to advancing the industry.