The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2021
Filed:
Dec. 27, 2019
Intel Corporation, Santa Clara, CA (US);
Daniel B. O'Brien, Beaverton, OR (US);
Christopher J. Wiegand, Portland, OR (US);
Lukas M. Baumgartel, Portland, OR (US);
Oleg Golonzka, Beaverton, OR (US);
Dan S. Lavric, Portland, OR (US);
Daniel B. Bergstrom, Lake Oswego, OR (US);
Jeffrey S. Leib, Hillsboro, OR (US);
Timothy Michael Duffy, Beaverton, OR (US);
Dax M. Crum, Beaverton, OR (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
Disclosed herein are structures, methods, and assemblies related to metallization in integrated circuit (IC) structures. For example, in some embodiments, an IC structure may include a first nanowire in a metal region and a second nanowire in the metal region. A distance between the first nanowire and the second nanowire may be less than 5 nanometers, and the metal region may include tungsten between the first nanowire and the second nanowire.