Company Filing History:
Years Active: 2021
Title: Innovations of Timothy Michael Duffy
Introduction
Timothy Michael Duffy is an accomplished inventor based in Beaverton, Oregon. He has made significant contributions to the field of integrated circuit structures, showcasing his expertise through his innovative patent.
Latest Patents
Duffy holds a patent titled "Metallization in Integrated Circuit Structures." This patent discloses structures, methods, and assemblies related to metallization in integrated circuit (IC) structures. In some embodiments, an IC structure may include a first nanowire in a metal region and a second nanowire in the same region. Notably, the distance between the first and second nanowires may be less than 5 nanometers, with tungsten present in the metal region between them.
Career Highlights
Timothy Duffy is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His work at Intel has allowed him to explore and develop cutting-edge technologies in the field of integrated circuits.
Collaborations
Duffy has collaborated with notable colleagues, including Daniel B O'Brien and Christopher J Wiegand. These collaborations have contributed to the advancement of technology in their respective fields.
Conclusion
Timothy Michael Duffy's innovative work in integrated circuit structures exemplifies the impact of his contributions to technology. His patent on metallization techniques highlights his role as a key inventor in the industry.