San Jose, CA, United States of America

Jae M Park

This inventor holds 13 USPTO granted patents and 2 published patent applications, primarily in Microelectronic Packaging. Top assignee: Adeia Semiconductor Bonding Technologies Inc.. Active years: 2006-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jae M Park. Retrieved from https://idiyas.com/inventor/jae-m-park-pe8xzqyc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 13 

% Patents Active = 69.2

Average Co-Inventor Count = 3.5

ph-index = 8

Forward Citations = 602(Granted Patents)


Company Filing History:


Years Active: 2006-2014

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Areas of Expertise:
Microelectronic Packages
Fine Pitch Microcontacts
Image Sensor Package
Connection Components
Stackable Carriers
Flexible Assemblies
High Frequency Chips
Conductive Posts
Bondable Wires
Self-Aligning Features
Compliant Layers
Solid State Lighting
13 patents (USPTO):Explore Patents

Title: The Innovations of Jae M Park: Pioneering Microelectronics

Introduction

Jae M Park is a prominent inventor based in San Jose, CA, with an impressive portfolio of 13 patents to his name. His innovative contributions to the field of microelectronics reflect a deep understanding of the intricate technologies that drive the semiconductor industry.

Latest Patents

Among Park's latest patents is a groundbreaking method for creating fine pitch microcontacts. This method involves applying a final etch-resistant material to an in-process substrate, which protects the microcontact portions during etching. The design features microcontacts that project vertically from the substrate, with dimensions that adapt based on their position within the structure. Additionally, Park is credited with a patent concerning a method of making a connection component involving posts and pads. This component enhances microelectronic packaging by integrating dielectric layers, traces, and elongated leads, thus improving connectivity and functionality in microelectronic elements.

Career Highlights

Park has dedicated his career to advancing semiconductor bonding technologies, currently working at Adeia Semiconductor Bonding Technologies Inc. His innovative work has positioned him as a leader in the field, significantly influencing microelectronics design and manufacturing processes.

Collaborations

Throughout his career, Park has collaborated with esteemed professionals such as Teck-Gyu Kang and Belgacem Haba. These partnerships have fostered an environment of creativity and innovation, leading to the development of pivotal technologies within the microelectronics sector.

Conclusion

Jae M Park's contributions to the field of microelectronics through his numerous patents underscore his role as a visionary inventor. His methods and technologies not only enhance the current state of semiconductor manufacturing but also pave the way for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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