The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7304376 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 04, 2007

Filed:

Jul. 28, 2004
Applicants:

Belgacem Haba, Cupertino, CA (US);

Jae M. Park, San Jose, CA (US);

Teck-gyu Kang, San Jose, CA (US);

Nicholas J. Colella, Pleasanton, CA (US);

Inventors:

Belgacem Haba, Cupertino, CA (US);

Jae M. Park, San Jose, CA (US);

Teck-Gyu Kang, San Jose, CA (US);

Nicholas J. Colella, Pleasanton, CA (US);

Assignee:

Tessers, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A microelectronic element such as a semiconductor chip has springs such as coil springs bonded to contacts so that the springs serve as electrical connections to a circuit panel. The unit can be tested readily and can be surface-mounted to a circuit panel by bonding the distal ends of the springs, remote from the microelectronic element, to the panel. The springs can also serve as antennas so as to provide a miniaturized phased array.


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Haba, Belgacem. (2007). Microelectronic assemblies with springs (U.S. Patent No. 7304376). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7304376

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