The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2009
Filed:
Jun. 24, 2005
Yoichi Kubota, Pleasanton, CA (US);
Teck-gyu Kang, San Jose, CA (US);
Jae M. Park, San Jose, CA (US);
Belgacem Haba, Saratoga, CA (US);
Yoichi Kubota, Pleasanton, CA (US);
Teck-Gyu Kang, San Jose, CA (US);
Jae M. Park, San Jose, CA (US);
Belgacem Haba, Saratoga, CA (US);
Tessera, Inc., San Jose, CA (US);
Abstract
A packaged microelectronic element includes connection component incorporating a dielectric layer () carrying traces () remote from an outer surface (), posts () extending from the traces and projecting beyond the outer surface of the dielectric, and pads () exposed at the outer surface of the dielectric layer, the pads being connected to the posts by the traces. The dielectric element overlies the front surface of a microelectronic element, and contacts () exposed on the front surface of the microelectronic element are connected to the pads by elongated leads () such as wire bonds. Methods of making the connection component are also disclosed.