The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2006
Filed:
Aug. 13, 2003
Applicants:
Kyong-mo Bang, Sunnyvale, CA (US);
Teck-gyu Kang, San Jose, CA (US);
Jae M. Park, San Jose, CA (US);
Inventors:
Kyong-Mo Bang, Sunnyvale, CA (US);
Teck-Gyu Kang, San Jose, CA (US);
Jae M. Park, San Jose, CA (US);
Assignee:
Tessera, Inc., San Jose, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/544 (2006.01); H01L 23/34 (2006.01); H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A microelectronic package is made by a process which includes folding a substrate. Alignment elements on different parts of the substrate engage one another during the folding process to position the parts of the substrate precisely relative to one another. One or more of the alignment elements may be a mass of an overmolding encapsulant covering a chip.