The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2007
Filed:
Apr. 21, 2005
Masud Beroz, Livermore, CA (US);
Jae M. Park, San Jose, CA (US);
Belgacem Haba, Cupertino, CA (US);
Fion Tan, San Jose, CA (US);
Philip R. Osborn, San Jose, CA (US);
Masud Beroz, Livermore, CA (US);
Jae M. Park, San Jose, CA (US);
Belgacem Haba, Cupertino, CA (US);
Fion Tan, San Jose, CA (US);
Philip R. Osborn, San Jose, CA (US);
Tessera, Inc., San Jose, CA (US);
Abstract
A connection component for a semiconductor chip includes a substrate having a gap over which extends a plurality of parallel spaced apart leads. The ends of the leads are adhered to the substrate either by being bonded to contacts or being embedded in the substrate. The connection component can be formed, in one embodiment, by stitch bonding wire leads across the gap. In another embodiment, a prefabricated lead assembly supporting spaced apart parallel leads is juxtaposed and transferred to the substrate. The connection component is juxtaposed overlying a semiconductor chip whereby leads extending over the gap may have one end detached and bonded to an underlying chip contact.