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For the Inventor, By the Inventor

Chungcheongnam-do, South Korea

In-Ku Kang

USPTO Granted Patents = 18

Average Co-Inventor Count = 2.4

ph-index = 8

Forward Citations = 553(Granted Patents)


Location History:

  • Chungchcongnam-do, KR (2006)
  • Chungcheongnam-do, KR (2002 - 2007)
  • Cheonan-si, KR (2006 - 2009)
  • Cheonan, KR (2009)
  • Gyeonggi-do, KR (2010)
  • Suwon-si, KR (2011 - 2015)
  • Gunpo-si, KR (2018)

Company Filing History:

goldMedal18 out of 131,214 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2002-2018

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18 patents (USPTO):Explore Patents
1. 9872180 - Method for managing network access and electronic device therefor (2018-01-16),
2. 9129846 - Semiconductor package and method of forming (2015-09-08),
3. 8890330 - Semiconductor packages and electronic systems including the same (2014-11-18),
4. 8253232 - Package on package having a conductive post with height lower than an upper surface of an encapsulation layer to prevent circuit pattern lift defect and method of fabricating the same (2012-08-28),
5. 8178393 - Semiconductor package and manufacturing method thereof (2012-05-15),
6. 8008765 - Semiconductor package having adhesive layer and method of manufacturing the same (2011-08-30),
7. 7843051 - Semiconductor package and method of fabricating the same (2010-11-30),
8. 7521810 - Chip stack package and manufacturing method thereof (2009-04-21),
9. 7485955 - Semiconductor package having step type die and method for manufacturing the same (2009-02-03),
10. 7371675 - Method and apparatus for bonding a wire (2008-05-13),
11. 7368811 - Multi-chip package and method for manufacturing the same (2008-05-06),
12. 7282431 - Single chip and stack-type chip semiconductor package and method of manufacturing the same (2007-10-16),
13. 7176558 - Single chip and stack-type chip semiconductor package and method of manufacturing the same (2007-02-13),
14. 7098407 - Non-solder mask defined (NSMD) type wiring substrate for ball grid array (BGA) package and method for manufacturing such a wiring substrate (2006-08-29),
15. 7067413 - Wire bonding method, semiconductor chip, and semiconductor package (2006-06-27),
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