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For the Inventor, By the Inventor

Chungcheongnam-do, South Korea

In-Ku Kang

USPTO Granted Patents = 18

Average Co-Inventor Count = 2.4

ph-index = 8

Forward Citations = 553(Granted Patents)


Location History:

  • Chungchcongnam-do, KR (2006)
  • Chungcheongnam-do, KR (2002 - 2007)
  • Cheonan-si, KR (2006 - 2009)
  • Cheonan, KR (2009)
  • Gyeonggi-do, KR (2010)
  • Suwon-si, KR (2011 - 2015)
  • Gunpo-si, KR (2018)

Company Filing History:

goldMedal18 out of 131,611 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2002-2018

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18 patents (USPTO):Explore Patents
1. 9872180 - Method for managing network access and electronic device therefor (2018-01-16),
2. 9129846 - Semiconductor package and method of forming (2015-09-08),
3. 8890330 - Semiconductor packages and electronic systems including the same (2014-11-18),
4. 8253232 - Package on package having a conductive post with height lower than an upper surface of an encapsulation layer to prevent circuit pattern lift defect and method of fabricating the same (2012-08-28),
5. 8178393 - Semiconductor package and manufacturing method thereof (2012-05-15),
6. 8008765 - Semiconductor package having adhesive layer and method of manufacturing the same (2011-08-30),
7. 7843051 - Semiconductor package and method of fabricating the same (2010-11-30),
8. 7521810 - Chip stack package and manufacturing method thereof (2009-04-21),
9. 7485955 - Semiconductor package having step type die and method for manufacturing the same (2009-02-03),
10. 7371675 - Method and apparatus for bonding a wire (2008-05-13),
11. 7368811 - Multi-chip package and method for manufacturing the same (2008-05-06),
12. 7282431 - Single chip and stack-type chip semiconductor package and method of manufacturing the same (2007-10-16),
13. 7176558 - Single chip and stack-type chip semiconductor package and method of manufacturing the same (2007-02-13),
14. 7098407 - Non-solder mask defined (NSMD) type wiring substrate for ball grid array (BGA) package and method for manufacturing such a wiring substrate (2006-08-29),
15. 7067413 - Wire bonding method, semiconductor chip, and semiconductor package (2006-06-27),

Title: In-Ku Kang: Innovator in Network Management and Semiconductor Technology

Introduction

In-Ku Kang is a prominent inventor based in Chungcheongnam-do, South Korea. He has made significant contributions to the fields of network management and semiconductor technology. With a total of 18 patents to his name, Kang continues to push the boundaries of innovation in his industry.

Latest Patents

Kang's latest patents include a method for managing network access and an innovative semiconductor package. The method for managing network access involves determining whether there is a network connection request from at least one application. It checks at least one attribute information item of the application and determines an access point name (APN) corresponding to the application based on the attribute information. This method allows for efficient data transmission and reception using the determined APN. The semiconductor package he developed includes a package substrate with a bonding pad, multiple semiconductor chips stacked on the substrate, and a bonding wire that connects the chips to the bonding pad. This design enhances the functionality and efficiency of semiconductor devices.

Career Highlights

In-Ku Kang is currently employed at Samsung Electronics Co., Ltd., where he applies his expertise in developing cutting-edge technologies. His work has significantly impacted the company's product offerings and technological advancements.

Collaborations

Kang has collaborated with notable colleagues, including Jin-Ho Kim and Kyung-Man Kim, to further enhance the innovation process within his projects.

Conclusion

In-Ku Kang's contributions to network management and semiconductor technology exemplify his dedication to innovation. His work continues to influence the industry and inspire future advancements.

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