The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2011
Filed:
Sep. 04, 2009
In-ku Kang, Suwon-si, KR;
In-ku Kang, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Abstract
A semiconductor package includes a first substrate comprising a plurality of pads arranged in a first side of the first substrate, a plurality of first semiconductor chips stacked on the first side of the first substrate and each first semiconductor chip comprising a plurality of chip pads arranged in a first side of respective first semiconductor chips, and a sealant arranged on the first substrate, the sealant sealing the first semiconductor chips, wherein at least one of the first semiconductor chips comprises a plurality of redistribution pads arranged in the first side of the at least one semiconductor chip, and a plurality of adhesive layers having portions exposed by the sealant, each adhesive layer is disposed on respective redistribution pads.