The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2007
Filed:
Dec. 29, 2006
Applicants:
In-ku Kang, Chungcheongnam-do, KR;
Sung-hwan Yoon, Chungcheongnam-do, KR;
Inventors:
In-Ku Kang, Chungcheongnam-do, KR;
Sung-Hwan Yoon, Chungcheongnam-do, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package comprises a substrate having connection pads disposed thereon, a semiconductor chip attached to the substrate such that an active surface of the semiconductor chip faces the substrate, and external bonding pads electrically connected to the active surface of the semiconductor chip. The external bonding pads may be formed near the ends of the frame and have an upper surface facing away from the substrate. The external bonding pads are electrically connected with the connection pads.