The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2012
Filed:
Jan. 25, 2010
Applicants:
Kyung-man Kim, Hwaseong-si, KR;
In-ku Kang, Suwon-si, KR;
Inventors:
Kyung-man Kim, Hwaseong-si, KR;
In-ku Kang, Suwon-si, KR;
Assignee:
SAMSUNG Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/50 (2006.01);
U.S. Cl.
CPC ...
Abstract
A package on package includes a lower semiconductor package including a plurality of stacked semiconductor chips, a connection portion including an electrically-conductive lead having a height lower than that of an encapsulation member, and an upper semiconductor package connected to the connection portion of the lower semiconductor package via a solder ball in a fan-in structure.
Kim, Kyung-man. (2012). Package on package having a conductive post with height lower than an upper surface of an encapsulation layer to prevent circuit pattern lift defect and method of fabricating the same (U.S. Patent No. 8253232). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8253232
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile