The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2009
Filed:
Aug. 11, 2006
Applicants:
In-ku Kang, Cheonan-si, KR;
Pyoung-wan Kim, Cheonan-si, KR;
Inventors:
In-Ku Kang, Cheonan-si, KR;
Pyoung-Wan Kim, Cheonan-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A chip stack package may include a package substrate, a plurality of semiconductor chips mounted on the package substrate, bonding wires electrically connecting the semiconductor chips to the package substrate, and spacers interposed between the adjacent semiconductor chips. Each of the spacers may include a plurality of metal bumps. The spacers may be higher than the highest point of the bonding wire from the active surface of the semiconductor chip.