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For the Inventor, By the Inventor

Tainan, Taiwan

I-Chih Chen

USPTO Granted Patents = 37 

Average Co-Inventor Count = 5.0

ph-index = 4

Forward Citations = 50(Granted Patents)


Location History:

  • Taipei, TW (2017 - 2023)
  • Tainan, TW (2015 - 2024)
  • Hsinchu, TW (2024)

Company Filing History:

goldMedal36 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal6 out of 98 
 
TSMC Nanjing Company, Limited
 patents
bronzeMedal1 out of 1,962 
 
Via Technologies, Inc.
 patents
where one patent can have more than one assignee

Years Active: 2015-2025

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37 patents (USPTO):Explore Patents
1. 12463035 - Trench etching process for photoresist line roughness improvement (2025-11-04),
2. 12389625 - Semiconductor device with gate (2025-08-12),
3. 12255134 - Method of back end of line via to metal line margin improvement (2025-03-18),
4. 12159921 - Semiconductor device and method of manufacturing the same (2024-12-03),
5. 12020933 - Trench etching process for photoresist line roughness improvement (2024-06-25),
6. 11955484 - Semiconductor device and manufacturing method thereof (2024-04-09),
7. 11627390 - Encoding method, playing method and apparatus for image stabilization of panoramic video, and method for evaluating image stabilization algorithm (2023-04-11),
8. 11600727 - Method of forming semiconductor device with gate (2023-03-07),
9. 11532728 - Method semiconductor device fabrication with improved epitaxial source/drain proximity control (2022-12-20),
10. 11527406 - Trench etching process for photoresist line roughness improvement (2022-12-13),
11. 11437495 - Semiconductor device and method of manufacturing the same (2022-09-06),
12. 11404413 - Semiconductor device and manufacturing method thereof (2022-08-02),
13. 11276638 - Back end of line via to metal line margin improvement (2022-03-15),
14. 11271111 - Source/drain structure with barrier in FinFET device and method for forming the same (2022-03-08),
15. 11145760 - Structure having improved fin critical dimension control (2021-10-12),

Title: The Innovative Journey of Inventor I-Chih Chen

Introduction:

I-Chih Chen, a pioneering inventor hailing from Tainan, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations and patents.

Latest Patents:

I-Chih Chen's latest patents include advancements in renewable energy technology, specifically in the development of solar panel efficiency and energy storage solutions.

Career Highlights:

With a career spanning over two decades, I-Chih Chen has established himself as a leading figure in the tech industry. His work has led to the creation of cutting-edge solutions that have revolutionized the way we harness and utilize energy.

Collaborations:

Throughout his career, I-Chih Chen has collaborated with top research institutions and leading tech companies to further his innovative projects. His partnerships have been instrumental in bringing his ideas to life and making a tangible impact on the industry.

Conclusion:

Inventor I-Chih Chen's relentless pursuit of innovation and his commitment to pushing the boundaries of technology have solidified his position as a trailblazer in the field. His work continues to inspire future generations of inventors and shape the landscape of the tech industry.

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