The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2025
Filed:
Jun. 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Tsmc Nanjing Company, Limited, Nanjing, CN;
Sheng-Lin Hsieh, Hsinchu, TW;
I-Chih Chen, Hsinchu, TW;
Ching-Pei Hsieh, Hsinchu, TW;
Kuan Jung Chen, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
TSMC NANJING COMPANY, LIMITED, Nanjing, CN;
Abstract
A method of forming a semiconductor device structure includes forming a first resist structure over a hard mask. The method further includes patterning the first resist structure to form a trench therein. The method further includes performing a first hydrogen plasma treatment to the patterned first resist structure, wherein the first hydrogen plasma treatment is configured to smooth sidewalls of the trench. The method further includes patterning the hard mask using the patterned resist structure as an etch mask. The method further includes forming a second resist structure over the patterned hard mask. The method further includes patterning the second resist structure to form an opening therein. The method further includes performing a second hydrogen plasma treatment to the patterned second resist structure. The method further includes patterning the patterned hard mask using the patterned second resist structure as a second etch mask.