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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Ching-Pei Hsieh

This inventor holds 28 USPTO granted patents and 4 published patent applications, primarily in Resistive Memory Technology. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., TSMC Nanjing Company, Limited. Active years: 2014-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ching-Pei Hsieh. Retrieved from https://idiyas.com/inventor/ching-pei-hsieh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 28 

% Patents Active = 67.9

Average Co-Inventor Count = 4.1

ph-index = 7

Forward Citations = 194(Granted Patents)


Location History:

  • Zhudong Township, TW (2015 - 2017)
  • Kaoshiung, TW (2017)
  • Kaohsiung, TW (2014 - 2022)
  • Hsinchu, TW (2024)

Company Filing History:

goldMedal28 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal3 out of 111 
 
TSMC Nanjing Company, Limited
 patents
where one patent can have more than one assignee

Years Active: 2014-2025

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Areas of Expertise:
Trench Etching
Resistance Variable Memory
RRAM Device
Memory Fabrication
Semiconductor Structure
MIM Capacitors
Low Voltage RRAM
1T1R RAM Structure
Memory Cell Design
Memory Device Formation
Side Bottom Contact RRAM
Composite Spacer Process
28 patents (USPTO):Explore Patents
1. 12463035 - Trench etching process for photoresist line roughness improvement (2025-11-04),
2. 12020933 - Trench etching process for photoresist line roughness improvement (2024-06-25),
3. 11527406 - Trench etching process for photoresist line roughness improvement (2022-12-13),
4. 11018299 - Memory cell having resistance variable film and method of making the same (2021-05-25),
5. 10957852 - Resistance variable memory structure and method of forming the same (2021-03-23),
6. 10629811 - Resistance variable memory structure and method of forming the same (2020-04-21),
7. 10516107 - Memory cell having resistance variable film and method of making the same (2019-12-24),
8. 10483322 - Memory device and method for fabricating the same (2019-11-19),
9. 10164184 - Resistance variable memory structure and method of forming the same (2018-12-25),
10. 10164183 - Semiconductor device and manufacturing method thereof (2018-12-25),
11. 10158073 - Manufacturing method of semiconductor structure (2018-12-18),
12. 10158069 - Memory cell having resistance variable film and method of making the same (2018-12-18),
13. 9853091 - Side bottom contact RRAM structure (2017-12-26),
14. 9837606 - Resistance variable memory structure and method of forming the same (2017-12-05),
15. 9837605 - Memory cell having resistance variable film and method of making the same (2017-12-05),

Title: The Innovative Contributions of Ching-Pei Hsieh

Introduction

Ching-Pei Hsieh, based in Kaohsiung, Taiwan, is a notable inventor with a remarkable portfolio of 27 patents. His contributions to the field of semiconductor device technology have significantly advanced the industry, showcasing his expertise and innovative approach.

Latest Patents

One of Hsieh's latest patents focuses on a trench etching process aimed at improving photoresist line roughness. This method involves forming a resist structure over a substrate, which includes an anti-reflective coating (ARC) layer and a photoresist layer. The process entails patterning the photoresist layer to create a trench and subjecting it to hydrogen plasma treatment to smooth the trench's sidewalls without etching the ARC layer. Subsequently, the ARC layer is patterned using the photoresist layer as an etch mask. This innovative approach demonstrates Hsieh's commitment to enhancing semiconductor manufacturing techniques.

Career Highlights

Hsieh has worked with several prominent companies, notably Taiwan Semiconductor Manufacturing Company and TSMC Nanjing Company, Limited. His tenure at these organizations has allowed him to develop and refine cutting-edge technologies in semiconductor manufacturing, further solidifying his status as a leading inventor in the field.

Collaborations

Throughout his career, Hsieh has collaborated with esteemed colleagues, including Shih-Chang Liu and Chern-Yow Hsu. These partnerships have fostered innovative problem-solving and creative advancements in semiconductor fabrication processes.

Conclusion

Ching-Pei Hsieh’s extensive list of patents and collaborations is a testament to his innovative spirit and dedication to advancing technology in the semiconductor industry. His work continues to influence the development of cutting-edge devices, reflecting his significant contributions to this critical field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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