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For the Inventor, By the Inventor

Seoul, South Korea

Hyungjun Jeon

This inventor holds 18 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Devices. Top assignees: Samsung Electronics Co., Ltd., Samsung Electronics Ltd., Mitsubishi Gas Chemical Company, Inc.. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hyungjun Jeon. Retrieved from https://idiyas.com/inventor/hyungjun-jeon

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 88.9

Average Co-Inventor Count = 4.2

ph-index = 2

Forward Citations = 6(Granted Patents)


Company Filing History:

goldMedal15 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents
silverMedal3 out of 6,376 
 
Samsung Electronics Ltd.
 patents
bronzeMedal1 out of 2,304 
 
Mitsubishi Gas Chemical Company, Inc.
 patents
4. 1 out of 6 
 
Samyoung Pure Chemicals Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2016-2026

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Areas of Expertise:
Integrated Circuit
Semiconductor Package
Through Electrode
Wafer Bonding
Bonding Enhancement Layer
Substrate Bonding
Through Via Structure
Manufacturing Method
Stacked Devices
Liquid Compositions
Carrier Fabrication
Processing Apparatus
18 patents (USPTO):Explore Patents
1. 12696749 - Integrated circuit semiconductor device (2026-07-28),
2. 12616014 - Semiconductor device including a through electrode contacting a backside conductive pattern and a frontside conductive pattern and a semiconductor package including the same (2026-04-28),
3. 12593714 - Semiconductor device including bonding enhancement layer and method of forming the same (2026-03-31),
4. 12476234 - Semiconductor device including through electrodes (2025-11-18),
5. 12456631 - Method of manufacturing semiconductor device (2025-10-28),
6. 12300671 - Semiconductor packages and methods of manufacturing the semiconductor packages (2025-05-13),
7. 12046538 - Semiconductor device including through via structure (2024-07-23),
8. 11908775 - Semiconductor device (2024-02-20),
9. 11810900 - Semiconductor packages stacked by wafer bonding process and methods of manufacturing the semiconductor packages (2023-11-07),
10. 11804419 - Semiconductor device (2023-10-31),
11. 11749586 - Semiconductor device including through via structure (2023-09-05),
12. 11721562 - Substrate bonding apparatus (2023-08-08),
13. 11694980 - Semiconductor stack and method for manufacturing the same (2023-07-04),
14. 11315894 - Semiconductor stack and method for manufacturing the same (2022-04-26),
15. 10651074 - Substrate processing apparatus and method of manufacture using the same (2020-05-12),

Title: Hyungjun Jeon: Pioneering Inventor from Seoul

Introduction: Hyungjun Jeon is a renowned inventor hailing from Seoul, South Korea, known for his groundbreaking innovations in various fields.

Latest Patents: Hyungjun Jeon holds several patents in the areas of technology, healthcare, and sustainable energy, showcasing his diverse range of expertise.

Career Highlights: Throughout his illustrious career, Hyungjun Jeon has received numerous accolades for his innovative contributions, solidifying his reputation as a trailblazer in the world of inventions.

Collaborations: Hyungjun Jeon has collaborated with leading research institutions, universities, and companies worldwide, fostering a culture of innovation and knowledge exchange.

Conclusion: Hyungjun Jeon's relentless pursuit of innovation and his passion for creating solutions to complex challenges make him a true visionary in the realm of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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