The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 2026
Filed:
May. 19, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Seungha Oh, Suwon-si, KR;
Jaewon Hwang, Suwon-si, KR;
Kwangjin Moon, Suwon-si, KR;
Hojin Lee, Suwon-si, KR;
Hyungjun Jeon, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
An integrated circuit semiconductor device includes a substrate having a first surface and a second surface opposite to the first surface; a power via penetrating between the first surface and the second surface of the substrate; a cell part including a plurality of individual elements having different thicknesses inside the substrate, and a recess positioned between the individual elements; a signal wiring part on the first surface of the substrate and including an upper multilayer wiring layer connected to the power via; a power transmission network part under the second surface of the substrate and including a lower multilayer wiring layer connected to the power via; and an external connection terminal under the power transmission network part and connected to the lower multilayer wiring layer, wherein the substrate includes a plurality of regions having different thicknesses.