IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11721562 B1

PDFFull Text
Date of Patent:
Aug. 08, 2023

Filed:

Sep. 08, 2020

Substrate bonding apparatus

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hyungjun Jeon, Seoul, KR;

Taeyeong Kim, Yongin-si, KR;

Hoechul Kim, Seoul, KR;

Junhong Min, Ulsan, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Muir Patent Law, PLLC

Primary Examiner:

Jacob T Minskey

Assistant Examiner:

Matthew Hoover

Int. Cl.
CPC ...
H01L 21/00 (2006.01); B32B 37/00 (2006.01); B32B 41/00 (2006.01); H01L 21/67 (2006.01); H01L 23/00 (2006.01); H01L 21/687 (2006.01); H01L 25/00 (2006.01); H01L 27/146 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67017 (2013.01); B32B 37/003 (2013.01); B32B 37/0046 (2013.01); B32B 41/00 (2013.01); H01L 21/67092 (2013.01); H01L 24/74 (2013.01); B32B 2309/02 (2013.01); B32B 2309/12 (2013.01); B32B 2309/60 (2013.01); B32B 2457/14 (2013.01); H01L 21/6838 (2013.01); H01L 21/68742 (2013.01); H01L 25/50 (2013.01); H01L 27/1469 (2013.01);
Abstract

A substrate bonding apparatus for bonding a first substrate to a second substrate includes a first bonding chuck configured to fix the first substrate to a first surface of the first bonding chuck; a second bonding chuck configured to fix the second substrate to a second surface of the second bonding chuck, the second surface facing the first surface; a process gas injector surrounding at least one selected from the first bonding chuck and the second bonding chuck in a plan view, the process gas injector configured to inject a process gas between the first substrate and the second substrate when respectively disposed on the first bonding chuck and the second bonding chuck; and an air curtain generator disposed at an outside of the process gas injector in the plan view, the air curtain generator configured to inject an air curtain forming gas to form an air curtain surrounding the first substrate and the second substrate.

Find Patent Forward Citations

Loading…