IDiyas

For the Inventor, By the Inventor

Hsin-Chu, Taiwan

Hui-Lin Chang

USPTO Granted Patents = 20 

Average Co-Inventor Count = 4.1

ph-index = 6

Forward Citations = 81(Granted Patents)


Company Filing History:

goldMedal20 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2006-2016

Loading Chart...
20 patents (USPTO):Explore Patents
1. 9385034 - Carbonization of metal caps (2016-07-05),
2. 9219036 - Interconnect structure for semiconductor devices (2015-12-22),
3. 8999842 - Interconnect structure for semiconductor devices (2015-04-07),
4. 8987085 - Methods for improving uniformity of cap layers (2015-03-24),
5. 8785324 - Interconnect structure for semiconductor devices (2014-07-22),
6. 8330275 - Interconnect structure for semiconductor devices (2012-12-11),
7. 8264046 - Synergy effect of alloying materials in interconnect structures (2012-09-11),
8. 8158521 - Two step post-deposition treatment of ILD layer for a lower dielectric constant and improved mechanical properties (2012-04-17),
9. 8143162 - Interconnect structure having a silicide/germanide cap layer (2012-03-27),
10. 8053356 - Interconnect structure for semiconductor devices (2011-11-08),
11. 7977791 - Selective formation of boron-containing metal cap pre-layer (2011-07-12),
12. 7897505 - Method for enhancing adhesion between layers in BEOL fabrication (2011-03-01),
13. 7834458 - Interconnect structure for semiconductor devices (2010-11-16),
14. 7655556 - Interconnect structures for semiconductor devices (2010-02-02),
15. 7642189 - Synergy effect of alloying materials in interconnect structures (2010-01-05),

Title: Trailblazer in Technology: The Innovative Journey of Hui-Lin Chang

Introduction:

Hui-Lin Chang, a distinguished inventor based in Hsin-Chu, Taiwan, has made significant contributions to the world of technology and invention with his passion for innovation and relentless drive to solve complex problems. With an impressive track record of 20 patents, Hui-Lin Chang has solidified his reputation as a trailblazer in the industry.

Latest Patents:

Among his latest patents is "Carbonization of metal caps," which details an integrated circuit structure featuring a semiconductor substrate, a dielectric layer, a conductive wiring, and a metal carbide cap layer. Another innovative patent is the "Interconnect structure for semiconductor devices," which presents a method for manufacturing a semiconductor device with a cap layer for a copper interconnect structure embedded within a dielectric layer.

Career Highlights:

Hui-Lin Chang is a key figure at Taiwan Semiconductor Manufacturing Company Ltd., a leading semiconductor company known for driving technological advancements. Within the company, his expertise and innovative spirit have played a pivotal role in the development of cutting-edge technologies and solutions that have reshaped the industry.

Collaborations:

Throughout his career, Hui-Lin Chang has collaborated with talented individuals such as Yung-Cheng Lu and Syun-Ming Jang Jang, fostering a culture of innovation and knowledge-sharing. These collaborations have not only led to the creation of groundbreaking inventions but also inspired a new generation of inventors to push the boundaries of what is possible.

Conclusion:

In conclusion, Hui-Lin Chang's unwavering commitment to innovation and problem-solving has propelled him to the forefront of the technology and invention landscape. His impressive portfolio of patents, coupled with his collaborative spirit and contributions to Taiwan Semiconductor Manufacturing Company Ltd., underscore his status as a true trailblazer in the field. As he continues to push the boundaries of technological innovation, Hui-Lin Chang remains a driving force behind the advancement of the industry.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…