Huang-Chu Ko

Title: Huang-Chu Ko: Innovator in Chemical Mechanical Polishing Technology

Introduction

Huang-Chu Ko is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of chemical mechanical polishing, holding a total of 8 patents. His work focuses on enhancing the efficiency and effectiveness of polishing processes in semiconductor manufacturing.

Latest Patents

One of Huang-Chu Ko's latest patents is a chemical mechanical polishing apparatus and method. This innovation describes an apparatus and a method to detect a polishing pad profile during a polish process and adjust the polishing process based on the detected profile. The apparatus includes a polishing pad configured to polish a substrate, a substrate carrier designed to hold the substrate against the polishing pad, and a detection module that detects the profile of the polishing pad. The detection module features a probe that measures the thickness of various areas on the polishing pad, supported by a beam that allows the probe to move along its length.

Career Highlights

Huang-Chu Ko is currently employed at Taiwan Semiconductor Manufacturing Company Ltd., a leading firm in the semiconductor industry. His work has been instrumental in advancing polishing technologies that are critical for the production of high-quality semiconductor devices.

Collaborations

Huang-Chu Ko has collaborated with notable colleagues, including Chun-Hsi Huang and Bruce Cho. These partnerships have fostered innovation and contributed to the development of cutting-edge technologies in the semiconductor field.

Conclusion

Huang-Chu Ko's contributions to chemical mechanical polishing technology have established him as a key figure in the semiconductor industry. His innovative patents and collaborations continue to influence advancements in manufacturing processes.