The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2024

Filed:

May. 17, 2023
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Chun-Hsi Huang, Hsinchu, TW;

Huang-Chu Ko, Miaoli County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/015 (2012.01); B24B 37/04 (2012.01); B24B 37/10 (2012.01); B24B 49/14 (2006.01); B24B 55/02 (2006.01); B24B 57/02 (2006.01); B24B 37/30 (2012.01);
U.S. Cl.
CPC ...
B24B 37/015 (2013.01); B24B 37/042 (2013.01); B24B 37/107 (2013.01); B24B 49/14 (2013.01); B24B 55/02 (2013.01); B24B 57/02 (2013.01); B24B 37/30 (2013.01);
Abstract

An apparatus for performing a polishing process includes: a rotatable polishing pad; a temperature sensor configured to monitor a temperature on a top surface of the rotatable polishing pad; a first dispenser configured to dispense a first slurry that is maintained at a first temperature on the rotatable polishing pad; and a second dispenser configured to dispense a second slurry that is maintained at a second temperature on the rotatable polishing pad, wherein the second temperature is different from the first temperature so as to maintain the temperature on the top surface of the rotatable polishing pad at a substantially constant value.


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