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Taichung, Taiwan

Hsien-Wen Chen

USPTO Granted Patents = 13 (Patent Applications = 9)

Average Co-Inventor Count = 3.8

ph-index = 4

Forward Citations = 35(Granted Patents)

Location History:

Taichung Hsien, TW (2015)
Taichung, TW (2013 - 2019)

Company Filing History:

Siliconware Precision Industries Co., Ltd.

Years Active: 2013-2019

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13 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10403596 - Method of fabricating packaging structure (2019-09-03),

2. 10249562 - Package structure and fabrication method thereof (2019-04-02),

3. 10199320 - Method of fabricating electronic package (2019-02-05),

4. 10049973 - Electronic package and fabrication method thereof and substrate structure (2018-08-14),

5. 9875949 - Electronic package having circuit structure with plurality of metal layers, and fabrication method thereof (2018-01-23),

6. 9818683 - Electronic package and method of fabricating the same (2017-11-14),

7. 9748183 - Fabrication method of semiconductor package (2017-08-29),

8. 9627307 - Semiconductor package and fabrication method thereof (2017-04-18),

9. 9502335 - Package structure and method for fabricating the same (2016-11-22),

10. 9196596 - Interposer and method of manufacturing the same (2015-11-24),

11. 9058971 - Electro-optical module (2015-06-16),

12. 8970053 - Semiconductor package having light-emitting-diode solder-bonded on first and second conductive pads separated by at least 75 UM (2015-03-03),

13. 8486733 - Package having light-emitting element and fabrication method thereof (2013-07-16),

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