The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
May. 30, 2012
Yuen-han Wang, Taichung Hsien, TW;
Sheng-li LU, Taichung Hsien, TW;
Jih-fu Wang, Taichung-Hsien, TW;
Hsien-wen Chen, Taichung Hsien, TW;
Kuan-yu Yang, Taichung Hsien, TW;
Yuen-Han Wang, Taichung Hsien, TW;
Sheng-Li Lu, Taichung Hsien, TW;
Jih-Fu Wang, Taichung-Hsien, TW;
Hsien-Wen Chen, Taichung Hsien, TW;
Kuan-Yu Yang, Taichung Hsien, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A semiconductor package and a fabrication method thereof are disclosed, which is characterized in that a solder material is used to bond an LED chip and a substrate so as to provide a thick joint between the substrate and the LED chip and hence reduce stresses generated between the LED chip and the substrate due to their CTE mismatch, thereby preventing delamination from occurring between the LED chip and the substrate after a reliability test.