Company Filing History:
Years Active: 2015
Title: Kuan-Yu Yang: Innovator in Semiconductor Packaging
Introduction
Kuan-Yu Yang is a notable inventor based in Taichung Hsien, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly in the integration of light-emitting diodes (LEDs) with substrates. His innovative approach addresses critical challenges in the reliability of semiconductor devices.
Latest Patents
Kuan-Yu Yang holds a patent for a "Semiconductor package having light-emitting-diode solder-bonded on first and second conductive pads separated by at least 75 UM." This patent describes a semiconductor package and a fabrication method that utilizes solder material to bond an LED chip to a substrate. This design provides a thick joint that reduces stresses caused by the coefficient of thermal expansion (CTE) mismatch between the LED chip and the substrate. As a result, it effectively prevents delamination after reliability testing. He has 1 patent to his name.
Career Highlights
Kuan-Yu Yang is associated with Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor industry. His work has been instrumental in advancing the technology used in semiconductor packaging, enhancing the performance and reliability of electronic devices.
Collaborations
Some of his notable coworkers include Yuen-Han Wang and Sheng-Li Lu. Their collaborative efforts contribute to the innovative environment at Siliconware Precision Industries Co., Ltd.
Conclusion
Kuan-Yu Yang's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in technology. His work not only addresses current challenges but also paves the way for future advancements in the field.