This inventor holds 1 USPTO granted patent. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2015
Title: Jih-Fu Wang: Innovator in Semiconductor Packaging
Introduction
Jih-Fu Wang is a notable inventor based in Taichung-Hsien, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly through his innovative patent that addresses critical issues in LED chip bonding.
Latest Patents
Wang holds a patent for a "Semiconductor package having light-emitting-diode solder-bonded on first and second conductive pads separated by at least 75 UM." This invention focuses on a semiconductor package and its fabrication method, utilizing solder material to bond an LED chip to a substrate. This design aims to create a thick joint that reduces stress caused by the coefficient of thermal expansion (CTE) mismatch between the LED chip and the substrate. As a result, it effectively prevents delamination during reliability tests.
Career Highlights
Jih-Fu Wang is currently employed at Siliconware Precision Industries Co., Ltd., where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in enhancing the reliability and performance of semiconductor packages.
Collaborations
Wang collaborates with talented colleagues, including Yuen-Han Wang and Sheng-Li Lu, who contribute to the advancement of their projects and innovations.
Conclusion
Jih-Fu Wang's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in technology. His patent reflects a significant advancement in the field, showcasing his expertise and dedication to improving semiconductor reliability.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile