Sheng-Li Lu

Title: Innovations of Sheng-Li Lu in Electronic Packaging

Introduction

Sheng-Li Lu is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 3 patents. His work focuses on methods that enhance the efficiency and cost-effectiveness of electronic package fabrication.

Latest Patents

Sheng-Li Lu's latest patents include innovative methods for fabricating electronic packages. One of his patents describes a method that involves providing a carrier body with a first surface featuring multiple recessed portions. The second surface opposes the first and interconnects with these recessed portions. The process includes forming an electronic structure on the first surface, which contains conductive elements that fit into the recessed portions. A portion of the carrier body is then removed, exposing the conductive elements from the second surface. This method retains the carrier body and reduces fabrication costs by eliminating the need for temporary materials. Another patent outlines a similar method, emphasizing the retention of the carrier body and the reduction of costs without requiring temporary materials.

Career Highlights

Sheng-Li Lu is associated with Siliconware Precision Industries Co., Ltd., a company known for its advancements in semiconductor packaging and testing. His work has contributed to the company's reputation for innovation in electronic packaging solutions.

Collaborations

Sheng-Li Lu has collaborated with notable coworkers, including Hsien-Wen Chen and Ching-Wen Chiang. Their combined efforts have furthered advancements in the field of electronic packaging.

Conclusion

Sheng-Li Lu's contributions to electronic packaging through his innovative patents demonstrate his commitment to enhancing technology in this field. His work not only improves fabrication methods but also reduces costs, making significant strides in the industry.