The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2019
Filed:
Oct. 16, 2017
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Ching-Wen Chiang, Taichung, TW;
Kuang-Hsin Chen, Taichung, TW;
Sheng-Li Lu, Taichung, TW;
Hsien-Wen Chen, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A method of fabricating an electronic package is provided, including: providing a carrier body having a first surface formed with a plurality of recessed portions, and a second surface opposing the first surface and interconnecting with the recessed portions; forming on the first surface of the carrier body an electronic structure that has a plurality of conductive elements received in the recessed portions correspondingly; and removing portion of the carrier body, with the conductive elements exposed from the second surface of the carrier body. Therefore, the carrier body is retained, and the fabrication cost is reduced since temporary material is required. The present invention further provides the electronic package thus fabricated.