Taichung, Taiwan

Ching-Wen Chiang

USPTO Granted Patents = 12 

Average Co-Inventor Count = 3.4

ph-index = 3

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 2015-2019

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12 patents (USPTO):Explore Patents

Title: Innovations by Ching-Wen Chiang

Introduction

Ching-Wen Chiang is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 12 patents. His work focuses on innovative methods for fabricating electronic packages that enhance performance and reliability.

Latest Patents

One of his latest patents is titled "Package structure and fabrication method thereof." This invention provides a method for fabricating a package structure that includes several steps, such as providing a carrier with a recess, disposing an electronic element in the recess, and forming an insulating layer to encapsulate the electronic element. The method also involves creating a circuit structure on the carrier that is electrically connected to the electronic element, along with forming through holes that allow for the creation of conductors. This innovative approach helps to avoid warping of the package structure.

Another notable patent is "Electronic package and fabrication method thereof." This invention describes an electronic package that includes a circuit portion, an electronic element, and a lid member that covers the electronic element. A separation portion is formed between the lid member and the electronic element, which helps to prevent warping of the overall package structure. The invention also outlines a method for fabricating this electronic package, showcasing Chiang's expertise in the field.

Career Highlights

Ching-Wen Chiang is associated with Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor packaging industry. His work has significantly advanced the technology used in electronic packaging, making him a valuable asset to the company and the industry as a whole.

Collaborations

Chiang has collaborated with several talented individuals, including Kuang-Hsin Chen and Hsien-Wen Chen, who contribute to the innovative projects he undertakes. Their teamwork has led to the successful development of various patents and advancements in electronic packaging technology.

Conclusion

Ching-Wen Chiang's contributions to the field of electronic packaging through his innovative patents demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and pave the way for future innovations.

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